In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
How Much Heat can be Extracted from a Heat Sink?
Thermal transport from a heat sink creates a unique condition in heat transfer and fluid flow once it is placed on a PCB in an unducted fluid flow delivery system. Although a heat sink may appear structurally simple, the fluid flow through its fin field and thermal coupling between it and the surrounding create a rather complex problem. As a result, heat sinks are often … [Read more...]
Thermal Capacitance
When time enters the equations, the ability of a material to store or release heat becomes a crucial parameter. This issue's technical data column is devoted to a basic understanding of thermal capacitance. Thermal capacity (or heat capacity) is defined as: Cth = V � � cp [J/K] where: V =Volume (m3) = Density (kg/m3) cp = Specific heat (J/kgK) at constant pressure (the … [Read more...]
Glass: A Group Of Familiar Materials With Varying Properties
The knowledge to manufacture glass products is already 4500 - 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is loose, but, typically, inorganic products manufactured by fusing and then solidifying without crystallizing can be categorized as glasses. In the electronics industry … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
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