The knowledge to manufacture glass products is already 4500 - 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is loose, but, typically, inorganic products manufactured by fusing and then solidifying without crystallizing can be categorized as glasses. In the electronics industry … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
Packaging And Temperature Control Considerations For Planar Waveguide Circuits
Optical Networking The all-optical network has been emerging as a solution to provide higher bandwidth, lower cost systems for handling high capacity network traffic. Due to the inherent limits of copper wire and the high cost-per-bit of electrical systems, service providers will replace electrical components with fiber optic counterparts wherever possible as the cost of the … [Read more...]
Thermal Calculations for Multi-chip Modules
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
EMC and Thermal Design Conflicts in a PC
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are consuming more power, generating increased EM fields and more heat. Electronics equipment must comply with radiation limits … [Read more...]
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