High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a 1U rack-mount form factor. The current dual-processor system concept is targeted at the front-end server market (e.g., web hosting and mail routing), … [Read more...]
The Thermal Conductivity of Air at Reduced Pressures and Length Scales
In several earlier issues of Electronics Cooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure dependence, under 'normal' conditions, is virtually absent. But what is 'normal' these days? In 'normal' electronic systems we, indeed, need … [Read more...]
Thermal Calculations for Multi-chip Modules
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
Quick and easy fan/sink characterization
It is often necessary to generate in-house pressure-drop and base-to-ambient thermal resistance data for ducted fan/heat sink assemblies. For reliable applicability of the performance data, the configuration of the test article should closely match the intended application so that the test article coolant flow characteristics (turbulence level, 3-dimensionality, etc.) match … [Read more...]
Simplified Transient Model for IC Packages
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many times in which it is useful to know how rapidly the temperature of the chip changes when the applied power changes abruptly. This month's column presents a simple … [Read more...]
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