This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the board temperature (TB), then the junction temperature (TJ) can be determined by a simple application of the following formula: TJ … [Read more...]
Parameters affecting package thermal performance a low end system level example
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power trends seen in the 1980s for the bi-polar circuits [3] but with a time shift by a decade. It is a fortunate circumstance that a tremendous amount of heat transfer … [Read more...]
The submerged double jet impingement (SDJI) method for thermal testing of packages
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is one of the main functions of the package. To fully characterize the package thermally, numerical simulations and experimental tests are … [Read more...]
Visualization of air flows in electronics systems
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple shapes, such as cubical metal blocks simulating electronic components, often exhibit multi-dimensional flow phenomena that include … [Read more...]
CFD: One measly letter away from CAD
"The stuff you engineers design is too good," the guy from Marketing said, "I need shoddier! Can you make them less efficient and cheaper?" I was working for a small company that made electric power conditioning equipment. Our devices protected against spikes, sags and brownouts in the AC power for mission-critical equipment like air traffic control radar and the computer … [Read more...]
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