The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating media. Roughly, if more filler is used, then higher thermal conductivity is achieved. Phenomena related to manufacturability and strength often … [Read more...]
An alternative approach to junction-to-case thermal resistance measurements
As more and more integrated circuits dissipate power at levels once reserved for power discrete devices, junction-to-case thermal resistance (JC or RJC) remains as important as ever. The difficulties in making JC measurements often leads to values that do not accurately indicate true junction temperature (TJ). The measurement difficulties are usually two-fold. First is … [Read more...]
Characterizing a package on a populated printed circuit board
This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the board temperature (TB), then the junction temperature (TJ) can be determined by a simple application of the following formula: TJ … [Read more...]
Parameters affecting package thermal performance a low end system level example
Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power trends seen in the 1980s for the bi-polar circuits [3] but with a time shift by a decade. It is a fortunate circumstance that a tremendous amount of heat transfer … [Read more...]
The submerged double jet impingement (SDJI) method for thermal testing of packages
Over the past decades, the functionality of electronic parts has improved considerably. Increasing power requirements of semiconductor chips make it difficult to keep the temperature below the imposed limits. Thermal management of the chip is one of the main functions of the package. To fully characterize the package thermally, numerical simulations and experimental tests are … [Read more...]
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