Various new advanced composite materials are now available, which provide great advantages over conventional materials for electronic packaging thermal control, including: Extremely high thermal conductivities (up to twice that of copper) Low, tailorable coefficients of thermal expansion Extremely high strength and stiffness Low densities Low cost, net shape fabrication … [Read more...]
The thermal conductivity of ceramics
Ceramics are increasingly used in packages and printed circuit boards, because they have a number of advantages over plastics: much higher thermal conductivity, possible match of the coefficient of thermal expansion, and hermetic sealing. Unfortunately, the cost of ceramics is still much higher than that of plastics, prohibiting their use in low-cost high-volume products. … [Read more...]
Thermal design of fault tolerant and high availability computer systems
Thermal Design is one of the most challenging aspects of computer system design. This is definitely the case when it comes to designing for “fault tolerance” and “high availability” in high-speed multiprocessor-based systems. The inherent challenges associated with fault tolerance not only bring demanding design requirements but headaches as well. The term fault tolerance … [Read more...]
Use of thermal analysis information in avionics equipment development
IEEE Standard 1332-1998 [IEEE 1998] requires that, "The [equipment] supplier shall determine the customer's requirements and product needs," and that, "The [equipment] supplier, working with the customer, shall include the activities necessary to ensure that the customer's requirements and product needs are fully understood and defined, so that a comprehensive design … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part 1
One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard test environment are often used in this endeavor. The most common thermal metric [1,2] is the junction-to-air thermal resistance, JA (pronounced theta, … [Read more...]
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