The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 30 – June 2, 2023. This was the 22nd ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2023 was sponsored by the … [Read more...]
Thermal Modeling of a Silicon Germanium (SiGe) Radio Frequency Integrated Circuit (RFIC) for Wireless Communications
The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Weibull Distribution
A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Thermal Comfort Considerations for Electronics Cooling and Design
Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety and compliance standards required in their industry [2], thermal comfort is less well … [Read more...]
Machine Learning Optimization to Boost the Effectiveness of Phase Change Material (PCM)-Based On-Chip Passive Thermal Management
Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
- 1
- 2
- 3
- …
- 15
- Next Page »
