Simply stated, the problem with the use of volume weighted, effective thermal conductivity, kvw, in the thermal modeling of a printed circuit board (PCB), is inaccuracy. In this paper, we show how using kvw can lead to serious errors in the prediction of PCB temperatures. We recommend two, related, alternative procedures that provide greater … [Read more...]
Thermal Imaging Camera for Electronics Development and Testing Launched
FLIR Systems, Inc. announced the launch of the FLIR ETS320 thermal imaging solution for electronics testing in engineering benchtop environments. As the first FLIR camera designed specifically for benchtop work in testing and analyzing the thermal characteristics of electronic components and printed circuit boards (PCBs), the FLIR ETS320 aims to advance testing and diagnosis … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
New “Form-In-Place” Product with Process Demonstration Video
JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech PLC is engaged in providing creative solution to improve the reliability of electronics equipments. Established in … [Read more...]
Nominations Open for IEEE ITherm Achievement Award
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research contributions, of service to the electronics thermal/thermo-mechanical management community, and of … [Read more...]
