By: Chandan K. Roy1, Sushil Bhavnani1, Michael C. Hamilton2, R. Wayne Johnson3, Roy W. Knight1, & Daniel K. Harris1 1 Department of Mechanical Engineering, Auburn University, Auburn, AL 2 Department of Electrical and Computer Engineering, Auburn University, Auburn, AL 3Department of Electrical and Computer Engineering, Tennessee Tech University, Cookeville, … [Read more...]
New Dispensable Thermal Pads Now Available in Europe
Ellsworth Adhesives Europe, a distributor of adhesives and specialty chemicals, has announced the release of Dow Corning’s newest series of dispensable thermal pads into the European market. The new dispensable thermal pads are specially designed for the high performance demands of the electronics market. This innovative technology provides a cost-effective thermal management … [Read more...]
Thermal Adhesive Tape Reduces PCB Production Time
Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the PCBs to be finished/ supplied with a thermally conductive, mechanical fixing tape pre-applied and thus reducing … [Read more...]
Thermal Interface Material Suits Component-Heavy Circuit Boards
Fujipoly has released SARCON SPG-30A, a thermal interface material ideal for circuit boards with a large surface area, numerous components and delicate solder points. Featuring high viscosity and ultra-low compression force, the form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. Once applied, SARCON … [Read more...]
New TIM Boosts Performance Over Thermal Greases
Indium Corporation has announced the release of its new Heat-Spring® thermal interface material, which was featured at PCIM this month in Nuremberg, Germany. Heat-Spring is a patented technology designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs offer uniform thermal resistance at lower applied stresses in compressed … [Read more...]
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