Form-in-Place Thermal Compound for Delicate or Low Compression Requirements
Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low compression requirements. According to the company, the new thermal compound will not cause corrosion on metal surfaces and … [Read more...]
Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation
Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and good insulation with a thermal conductivity of 4 W/m-K, working temperature of -40°C to 105°C and tensile strength of 2 Kgf/mm2. … [Read more...]
Expanded Product Catalog Features New Thermal Interface Materials
Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several new pages of high-performance, low-cost thermal materials have been added to complement the company’s current … [Read more...]
Thermal Pad Offers Advantages of Thermal Grease Without Mess
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of thermal expansion (CTE) deficiencies. Naturally tacky with no adhesive, fiberglass or other non-conductive … [Read more...]
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