Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
Towards Reproducible ASTM D5470 Measurements at Lower Cost
Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be tested in its application to conclude its merits. Standardized testing is useful, however, for comparing TIMs in research and … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
PCMA Thermal Interface for Intel Core LGA-115x Processors
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a self-contained and sealed structure, deploying a phase-change metallic alloy (PCMA) which reflows and fills surface asperities on the CPU lid … [Read more...]
New Ultrathin Material May Lead to Better Thermally Conductive Coatings
Scientists at Kansas State University have discovered a new ultrathin electrically conductive material they say may lead to advances in the efficiency of electronic and thermal devices. Vikas Berry, the William H. Honstead professor of chemical engineering, and his colleagues found that manipulating molybdenum disulfide (MoS2)—a three-atom-thick inorganic compound … [Read more...]
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