The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA. According to background information provided by the inventors, the patent covers, “a thermal interface material assembly comprising: a thermal interface material having a first side and … [Read more...]
Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers
Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company, the increase in thermal conductivity is achieved without affecting the electrical insulation or other mechanical … [Read more...]
New Low-Thermal Resistance Gap Filler Pad
Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation dramatically reduces material tearing and damage during assembly and rework operations and improves cooling performance by filling unwanted air gaps between board components and … [Read more...]
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi - University of North Texas D. S. Kim - POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin films, accurate measurement of such materials has been difficult to achieve for thicknesses less than 1 µm. For example, conventional Fourier heater plate … [Read more...]
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD 22007-2 Hot disk) and a thermal resistance as low as 1.33°C cm2/W, the new formulation completely fills air gaps between components, board … [Read more...]
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