Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished assemblies. Ideal for precision form-in-place gaskets, encapsulation, coating, EMI and thermal grease applications, underfill and … [Read more...]
Thermally Conductive Acrylic Interface Pads
Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in demanding thermal applications. According to the company, the new 5590H series is ideal for cooling high intensity LEDs and bonding heat sinks, heat spreaders and other cooling devices to … [Read more...]
Gap Filler Thermal Interface Material for Silicone-Sensitive Electronic Applications
The Bergquist Company, a supplier of thermal management materials, has released Gap Filler 1500LV, a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone material with minimal outgassing.” According to the company, the new gap filler is ideal for use with fragile components … [Read more...]
Two Thermally Conductive Compounds Added to TIM Product Line
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal Management
Karthik Vijay, Indium Corporation’s technical manager for Europe, Africa and the Middle East, will present “Solder TIMs for Superior Thermal Management in Power Electronics” at PCIM Europe on Thursday, May 16 in Nuremberg, Germany. Vijay’s presentation will discuss TIMs containing indium that are developed specifically for high-power applications, and their performance … [Read more...]
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