Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
IBM Awarded Contract in First Phase of DARPA ICECool Program
Researchers at IBM Corp. in New York are reportedly examining potential ways to directly integrate liquid cooling into microchip designs and packaging to help “close the gap” between the chip and chip-cooling technologies in high performance military electronic systems. The IBM project is part of DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program, which seeks to … [Read more...]
Report Examines Trends in the Global TIM Materials Market
BCC Research has released a new market research report, titled “Thermal Interface Materials: Technologies, Applications and Global Markets.” According to the market research company, the primary goal of the new report is to provide “an up-to-date analysis of recent developments and current trends in the global TIM materials market.” The report also examines current products in … [Read more...]
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic thermal interface pads provide “good softness and conformability to non-flat surfaces [and] excellent compressive stress … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
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