Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface
Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance Enhancement at Inorganic Heterointerfaces Using Nanomolecular Monolayers,” will lead to new advances in cooling computer chips and LED … [Read more...]
Researchers Develop Possible New Heat Dissipation Method with Cold Plasma Treatment
Researchers from the College of Materials Science and Engineering at Beijing University of Chemical Technology in China have determined a new method for enhancing heat dissipation in microelectronics based on research on plasma-treated h-BN fillers. According to results published by Professor Yonglai Lu and Tui Ji, a master of engineering at the Center of Advanced Elastomer … [Read more...]
Cell Phone Battery Bursts into Flames in Man's Back Pocket
A cell phone battery spontaneously caught fire last month at a Defcon software hacker's session - while in the back pocket of the owner's pants. The phone caught on fire, burned through the anonymous man's pocket, and fell to the floor where it left burn marks. The man was sitting when he smelled something burning and felt some heat underneath him on his seat. He stood up to … [Read more...]
Carbon Fiber Sheet Prototype Challenges Thermal Grease
Sony Chemical & Information Device Corp. displayed a prototype of a sheet whose thermal conductivity it claims is equivalent to that of thermal grease and has a longer life span. The sheet, known as EX20000C, uses a combination of silicon and carbon fibers to produce a thermal conductive layer that is between 0.3 and 2mm thick and has a thermal resistance rating of … [Read more...]
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