Parker Hannifin Corporation’s new precision cooled rack for cooling critical wind turbine systems features two-phase evaporative cooling technology, which uses non-corrosive, non-conductive fluid, as it vaporizes and cools hot surfaces on contact. Parker’s Precision-Cooled Rack Solution can be used to cool critical wind turbine systems, including power conversion electronics, … [Read more...]
Companies Announce Partnership for Global Distribution
Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty materials, plus Gap Pad®, gap filling materials, phase change materials, and Bond-Ply®. Learn more … [Read more...]
Thermal Solver with Heat Transfer Simulation Package
MAYA HTT’s TMG-Thermal solver provides a comprehensive heat transfer simulation package, which allows fast and accurate solutions to complex thermal problems. Using finite difference control volume technology, TMG-Thermal makes it easy to numerically simulate nonlinear and transient heat transfer processes including coupled conduction, radiation, free and forced convection, 1D … [Read more...]
Miniaturization a Driving Force in Thermal Management Technologies Market
By 2016 the thermal management technologies market will be worth nearly $11 billion, compared with a 2010 value of $7.5 billion and $8 billion in 2011. According to a new report available on companiesandmarkets.com, this robust market growth is being driven by the significant progression in the technologies associated with - and the demand for - electronic systems and … [Read more...]
Gap Filler Pad with Low-Tac Top Surface
Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink. This allows for quick and easy removal without ripping, warping or damaging the … [Read more...]
- « Previous Page
- 1
- …
- 31
- 32
- 33
- 34
- 35
- …
- 43
- Next Page »
