Researchers at the Tyndall National Institute at University College Cork in Ireland have found a new way of cooling semiconductors in computers, mobiles and games consoles to improve their performance and reduce energy consumption. Most computers have thermal interface materials (TIM) to join the chip with the heat sink, with solder or a thin, film-like sheet. Solder is … [Read more...]
editoral: why standardization is mandatory: on the incorrect use of thermal impedance in the TIM world
Clemens J.M. Lasance Editor-in-Chief, Fall 2010 Issue Some time ago I devoted my editorial to the problems caused by the veeerrryyy slow adherence to the use of SI units to which the U.S. committed itself in 1872. When talking globalization we should speak the same scientific language, and when there are conflicts of interest, logical reasoning should prevail to decide upon … [Read more...]
product & industry news
Ultra-Thin Waterproof Piezoelectric Speaker Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The speaker achieves IPX7 grade waterproof protection without the need of a waterproof … [Read more...]
Thermal Grease Screen Printers
Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen across many industries: power electronics, electric vehicles (EV), ever shrinking handheld devices and … [Read more...]
Light Tack Adhesive Eases Fitting of Thermal Interface Pads
MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks. MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled … [Read more...]
- « Previous Page
- 1
- …
- 35
- 36
- 37
- 38
- 39
- …
- 43
- Next Page »
