ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the use of thermal greases as thermal interface materials. The implications are very important as they will affect the MTBF of electronic equipment. Read the paper from ATS Thermal Labs. … [Read more...]
High-Performance Thermal Putty
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier … [Read more...]
Carbon Nanotubes as High Performance Thermal Interface Materials
Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1]. Unless advanced thermal interface materials (TIMs) that achieve order-of-magnitude improvements in performance quickly emerge in the … [Read more...]
New heat sink series provide secure attachment with minimum of board real estate
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of increased size and mass. One of the biggest challenges for thermal/mechanical engineers is mechanically mounting larger heat sinks while minimizing the … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
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