Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM solutions include adhesives, greases, gels, phase change materials, pads, and solder alloys. Most TIMs consist of a polymer matrix, such as an … [Read more...]
Top 20 Considerations For Selecting Thermal Interface Materials
Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly. Thermal interfaces are usually an afterthought to designs but play a huge factor in the performance and reliability to a … [Read more...]
Developments with metallic thermal interface materials
Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with extremely high thermal conductivity filler materials, or with both. Metallic alloys with low … [Read more...]
Adhesion of Thermal Interface Materials for CPU Heatsinks, an Overlooked Issue
High performance thermal interface materials (TIMs) inserted between the CPU lid and heatsink - generally referred to as the "TIM2" - provide a reworkable low resistance thermal path in the package stack-up. It is well-recognized that users need to monitor the thermal performance of the TIMs to verify vendor data [1, 2]. Less well-known is that the TIM2 can also mechanically … [Read more...]
Packaging Challenges For High Heat Flux Devices
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]
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