Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed "III-V" have desirable electrical properties for applications such as microwave integrated circuits, light emitting diodes and laser diodes. Some of the … [Read more...]
Thermal Design And NEBS Compliance
Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a quick estimate of the external thermal resistance of a package or heat sink that does not warrant the use of powerful computer codes. In such cases an … [Read more...]
Advances In High-Performance Cooling For Electronics
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities. These limitations are principally related to the limited thermal conductivity of air for … [Read more...]
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