Silicon dioxide (SiO2) is one of the most common and also one of the most important materials in the world as it is the basis for our windows, beaches and wine glasses. It is also a source of silicon, of course. As such, the thermal conductivity (TC) of the bulk material is well documented. However, in many cases of interest to the thermal management of semiconductors (for … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures and larger temperature gradients. Handling these effects makes it more difficult to stay cost competitive, because … [Read more...]
Surface Flatness
Surface flatness is an important issue for thermal designers as it is directly related to thermal contact resistance between surfaces. In this column, the definitions of surface flatness related parameters are discussed. These definitions are presented here as in the ASME B46.1-1995 standard [1]. Surfaces are characterized by three main parameters: roughness, waviness, and … [Read more...]
CFD Prediction of Electronic Component Operational Temperature on PCBs
Introduction The thermal design of today's electronic equipment relies significantly on the use of Computational Fluid Dynamics (CFD) software for the prediction of electronics operational temperature. In the early to intermediate product design phase, CFD analysis is used to select a cooling strategy and refine a thermal design by parametric analysis. In the final design … [Read more...]
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