It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol and engine oils have, in general, poorer heat transfer properties than most solids. In spite of considerable research efforts, major improvements in … [Read more...]
Insulated Metal Printed Circuits – A User-Friendly Revolution In Power Design
Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means higher watt densities, which lead to increased heat. As the operating temperatures of components within a design increase, their performance, stability, and life … [Read more...]
Seven Years Of Technical Data: An Overview
The first 1997 issue of ElectronicsCooling started with a Technical Data column, the first of a still continuing series of columns devoted to data that are of interest to thermal designers. In the author's opinion, it is high time to come up with an overview of all items that have been covered over the past seven years. As is obvious from the table, the majority of columns … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
Trends in Cooling of Electronics: The Use of Thermal Roadmaps
Introduction Miniaturization, integration of functionality, and the increase of clock speed are recognized business drivers in the electronics industry today. Consequences are the fast increase in power dissipation leading to higher heat fluxes, higher temperatures and larger temperature gradients. Handling these effects makes it more difficult to stay cost competitive, because … [Read more...]
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