In the past, the thermal designer's role was seen as one of predicting temperatures and ensuring that reliability limits are met for products. However, the role of an effective thermal designer is much more than that. We believe that thermal designers are both critical and most useful in the early conceptual stages of product design. This is where they provide the most "bang … [Read more...]
Estimating Parallel Plate-fin Heat Sink Pressure Drop
In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
Challenges In Thermal Control Of Military Electronics Systems
Thermal design engineers working in defense electronics are facing many challenges, some of which have been around for a long time and some that are more recent. Worldwide climatic extreme temperatures are reasonably constant and there are many military electronic systems that function in these extremes. As a result, there is significant design history available for … [Read more...]
Glass: A Group Of Familiar Materials With Varying Properties
The knowledge to manufacture glass products is already 4500 - 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is loose, but, typically, inorganic products manufactured by fusing and then solidifying without crystallizing can be categorized as glasses. In the electronics industry … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
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