Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
Low temperature electronic cooling
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
Multilayer circuitry on metal substrates
Today's electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling systems may include conduction, convection and radiation cooling. Conduction can be the most efficient mode of heat transfer and about … [Read more...]
Natural convection modeling of heat sinks using web-based tools
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
The increasing importance of thermal test dies
Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a result of the steady state powering or the time dependence of the temperature increase or decrease in case of transient qualification. From these data, … [Read more...]
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