Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow

 

Figure 1: Sketches of the measurement cube. Introduction Computational fluid dynamics (CFD) codes are frequently used as design tools to predict the thermal processes in electronic circuitry. CFD codes can easily cope with a high level of complexity (component, board and system levels) which makes them attractive to use. However, the thermal and kinematic complexity of the … [Read more...]

Measuring fluid velocity in electronic enclosures

 

Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of measurement becomes a challenge since we are dealing with rather complex flows that tend to be highly nonisothermal. Therefore, it is our intention in this article to highlight the need … [Read more...]

One-dimensional heat flow

 

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face. Each face is at a uniform temperature. There is no heat flow out of the sides of the object. The cross- sectional area of the object in the direction of heat … [Read more...]

A simple method to estimate heat sink air flow bypass

 

Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]

Industry Sponsors

Sponsor
Sponsor