The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development and experimental validation of thermal models of avariety of `generic' electronic parts. DELPHI (which stands for … [Read more...]
Electronic package characterization per JEDEC standard
Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The junction temperature of a chip directly affectsthe performance of the circuits and the reliability of … [Read more...]
Environmental stress testing – a product improvement method
Introduction and Summary In today's competitive environment, the electronics industry is focusing onbusiness process re-engineering or product improvements with emphasis ondevelopment and manufacturing intervals and costs, warranty costs, fieldreliability, and customer maintenance costs. Some of the improvement methodsused are cross-functional teams, concurrent engineering, … [Read more...]
Why the traditional reliability prediction models do not work – is there an alternative?
Introduction While it is generally believed that reliability prediction methods should beused to aid product design and product development, the integrity andauditability of the traditional prediction methods have been found to bequestionable, in that the models do not predict field failures, cannot be usedfor comparative purposes, and present misleading trends and relations. … [Read more...]
Thermal conductivity of printed wiring boards
The thermal management of printed circuit boards is of increasing importanceas the power density of components and circuits continues to rise. Thesituation is complicated by the use of boards with multiple sheets of copperembedded in the electrically insulating boards to provide electromagneticshielding and to allow more three-dimensional connectivity of the circuitry bythe use … [Read more...]
