35th Annual Electronics Packaging Symposium

IBM Research, GE Aerospace, IEEC and CAMM at Binghamton University invite you to attend this two-day event on September 4 and 5, 2024 at the Center of Excellence at Binghamton University in Binghamton NY. Registration closes on August 29, 2024, no walk-ins are allowed.

The theme of this years symposium is a focus on packaging for Artificial Intelligence. Artificial Intellligence has been driving the industry for the last couple of yaars, we have seen how AI models require massive amounts of energy to process. Many of the new AI processors are designed to consume 1000 watts or more. This presents challenges in thermal management as well as substrate and interconnect design to properly deliver the power to the devices.

Our two keynotes from Samsung and AMD will describe the challenges and some possible solutions to these packaging challenges. Moving to the sesions, many of our speakers will also be discussing topics related to AI packaging.

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics.

• Future of Computing for HPC and AI
• Photonics Packaging
• Power Electronics
• Thermal Challenges / Harsh Environments
• Flexible & Additive Electronics
• Heterogeneous Integration
• Advance Substrates
• Wearable and Flexible Electronics for Medical Applications