SEMI-THERM 41

Explore cutting-edge topics and applications related to thermal design, such as Advanced Semiconductor Packaging and AI Accelerator, Chiplet and Heterogeneous Integration Packaging, Processors/ICs/Memory, 2.5D and 3-D Packaging, Data Centers, Board/System level, Portable/Consumer/Wearable Electronics, Fluid Movers, Acoustics, Power Electronics, Solid-State Lighting & Cooling, Advanced Materials, Measurement Methods, Modeling & Simulation, Additive Manufacturing, Reliability, and more.