Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
High Powered Chip Cooling — Air and Beyond
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new and has been with us since the days of bipolar chips. As can be seen in Figure 1, the heat flux associated with bipolar circuit technologies steadily increased from the … [Read more...]
Latest Developments In Thermoelectrically Enhanced Heat Sinks
Nomenclature Q Heat load (W) COP Coefficient of Performance I Electrical current (Amps) T Temperature (°C) R Electrical resistance (Ohms) Z TE Figure of Merit (1/K) where Z = α2 / (ρ λ) Greek Letters Δ Change in value θ Thermal resistance (°C/W) ρ Electrical resistivity (Ohm-cm) α Seebeck coefficient (V/K) λ Thermal conductivity … [Read more...]
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box by fans or blowers. In some applications, however, there may be airborne particulates or other substances in the air that would be injurious to the electrical … [Read more...]
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of the challenging aspects for improving heat sink performance is the effective utilization of relatively large air-cooled fin … [Read more...]
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