Cubitek has announced their new line of chassis – ICE Series. Including 5 new models, these ICE Series chassis using a 2.5(mm) extrusion aluminum construction are stronger than standard aluminum cases, yet thinner than other extrusion aluminum chassis. This build gives ICE Series a strong frame while still keeping a more lightweight design. The extrusion aluminum build … [Read more...]
New Snap-in Aluminum Electrolytic Capacitors
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current capability and operating life. As a result, the new capacitors are especially suited for applications in frequency … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
Graphite fiber reinforced al and cu alloys for thermal management applications
Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today's electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in less volume. To meet these challenges, electronic systems must dump large amounts of waste … [Read more...]
