Avionics systems designers and systems integrators are faced with the challenge of size, weight, and power (SWaP) constraints. Commercial, business, and military aviation customers increasingly desire modern avionics—whether installing in new aircraft platforms, or retrofitting current fleets of airplanes. Organizations are tapping the latest avionics innovations to pack a … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
Design and reliability considerations in avionics electronics packaging
In the avionics industry, regulatory agencies and standards organizations, such as Federal Aviation Regulation (FAR) [1], Aeronautical Radio, Inc. (ARINC) [2], and Radio Technical Commission for Aeronautics (RTCA) [3], have developed sets of test procedures that help design engineers test and verify their designs and prevent any safety-threatening failures. Too often, however, … [Read more...]
Use of thermal analysis information in avionics equipment development
IEEE Standard 1332-1998 [IEEE 1998] requires that, "The [equipment] supplier shall determine the customer's requirements and product needs," and that, "The [equipment] supplier, working with the customer, shall include the activities necessary to ensure that the customer's requirements and product needs are fully understood and defined, so that a comprehensive design … [Read more...]
Forced convection cooling of airborne electronics
Figure 1. AFT description Fin pitch = 25.01 per in = 985 per mPlate spacing, b = 0.200 in = 5.08 x 10-3 m Fin Length = 0.111 in = 2.8 x 10-3 m Flow passage hydraulic diameter 4rh = 0.004905 ft = 1.50 x 10-3 m Fin metal thickness = 0.004 in = 0.102 x 10-3 m Total heat transfer area/volume between plates, ß = 719.4 ft2 / ft3 = 2,360 m2 / m3 Fin area / total area = … [Read more...]
