INTRODUCTION The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of a packaging or an active cooling component depends on the quality of the data characterizing these various components. In the real world of manufacturing, such characterization … [Read more...]
Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop
Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership. The following article was published in the May 2003 issue as a Calculation Corner authored by Bob Simons. It is the sequel to the companion article, “Estimating Parallel Plate-Fin Heat Sink Thermal … [Read more...]
On-site Cogeneration for Reducing Data Center Primary Energy Use
Dustin W. Demetriou, PhD Email: dwdemetr@us.ibm.com As most readers are aware, the data center industry has put an increased focus on energy efficiency and environmental impact. Data centers in the United States are estimated to consume nearly 2% of the total electricity. The de facto metric used in the data center industry to evaluate energy efficiency has been the Power Usage … [Read more...]
A Simple Method to Understand Trade-Offs in Data Center Cooling
Cooling and thermal management are critical to data center reliability. Many organizations see cooling as a differentiating factor in the lifecycle cost of their data center. Recent industry guidelines [1] for data center cooling have suggested energy savings in air-cooled data centers by increasing the temperature of the cooling air. This increase enables two trends: reduced … [Read more...]
Strategies for the Thermal Modeling of Metal Traces on Printed Circuit Boards
Bruce Guenin, Assoc. Technical Editor Introduction As integrated circuit (IC) devices get more complex, the interconnections between them provided by printed circuit boards (PCBs) get more complicated as well. Thermal simulation software tools are getting more capable of importing PCB layouts and automating the process of creating a model of the PCB whose local thermal … [Read more...]
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