This column has emphasized methods of analyzing packages in the JEDEC-standard test environment. A thermal metric that lends itself to analyses of system applications is the junction-to-board thermal characterization parameter, JB. If one knows the board temperature (TB), then the junction temperature (TJ) can be determined by a simple application of the following formula: TJ … [Read more...]
Don't underestimate radiation in electronic cooling
don't underestimate radiation in electronics cooling Bruce M. Guenin, Ph.D., Associate Editor, Amkor Technology, Inc. It is easy to underestimate the role of thermal radiation as a significant contributor to electronics cooling in environments without forced air flow. By its very nature it is invisible. The proper treatment of it can be intimidating due to the complicated … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT. To summarize the uses of these metrics: JA represents the junction-to-air thermal resistance for a package tested in an industry-standard test environment. It is … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
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