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Application of Transient Thermal Methods to Moisture Diffusion Calculations, Part I

 

Bruce Guenin, Assoc. Editor, Electronics Cooling View Part 2 here. Introduction Many of the components currently used in electronics systems employ organic materials.  Under certain circumstances, the diffusion of moisture into electronic components can lead to problems in the electrical performance and overall reliability of these components.   Examples are the increase in … [Read more...]

Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known

 

Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]

Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1

 

Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]

ElectronicsCooling December 2011 Issue

 

Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Download the December 2011 issue here. … [Read more...]

ElectronicsCooling Winter 2010 Issue

 

Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical briefs. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Winter 2010 issue here. … [Read more...]

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