Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
calculation corner: a spreadsheet based matrix solution for a thermal resistance network: part 1
Ross Wilcoxon Rockwell Collins Cedar Rapids, Iowa A thermal resistance network analysis begins by defining discrete points within a system, known as nodes, and the thermal resistance between each set of nodes. Boundary conditions for external heat inputs and reference temperature(s) are applied to the appropriate nodes. Equations to relate nodal temperatures can be generated … [Read more...]
ElectronicsCooling Summer 2010 Print Issue
Don't miss out on the Summer 2010 issue of ElectronicsCooling, which includes feature articles on thermal design in silicon validation platforms, motor supports and small scale fans, and solar photovoltaic cell thermal measurements. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Summer 2010 issue here. … [Read more...]
Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment
The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given heat load, or allow higher component heat dissipation at a given temperature level. Readers who are unfamiliar with TE cooling … [Read more...]
Use of Power Law Regression in Packaging Thermal Calculations
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such as ΘJA (junction-to-ambient thermal resistance), for specific IC package designs on the basis of limited data. These metrics are in … [Read more...]
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