Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
A Simple Method to Estimate Boiling Heat Sink Performance
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
Estimating Dew Point Temperature For Water Cooling Applications
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a thermal management solution. A number of articles in ElectronicsCooling have addressed both the issue of increased power dissipation [1-4] and various … [Read more...]
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