Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue's Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP) at an arbitrary combination of chip power levels using the principle of superposition [1]. One of the main points of that article was that both … [Read more...]
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]
Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number
As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased heat loads at chip, module, and system levels of packaging. The article by Mohapatra [1] in this issue of ElectronicsCooling provides a good overview of both dielectric … [Read more...]
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a quick estimate of the external thermal resistance of a package or heat sink that does not warrant the use of powerful computer codes. In such cases an … [Read more...]
A Funny Thing Happened On The Way To The Heatsink
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal resistances: ΘJC , the junction-to-case thermal resistance for the package, ΘCS , the case-to-sink thermal resistance representing the thermal interface material (TIM) between the … [Read more...]
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