In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels formed between the fins. As noted in the second article this is often not the case and much of the … [Read more...]
The 45° Heat Spreading Angle – An Urban Legend?
Ever hear about the 45° heat spreading angle? Most of us have. However, no one I've talked to seems to know where it came from. Is it an urban legend, such as alligators in the sewers of Manhattan, or is it an eternal truth deposited into the collective subconscious of the thermal engineering community? However fascinating it might be to explore the historical origins of this … [Read more...]
Calculations for Thermal Interface Materials
It's no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the importance of thermal interface materials (TIMs) as a key factor in determining the thermal performance of packages intended for high-power applications. This … [Read more...]
Estimating Parallel Plate-fin Heat Sink Pressure Drop
In the last issue of ElectronicsCooling a methodology was presented for estimating parallel plate-fin heat sink thermal resistance [1]. The method presented assumes that the air flow rate is given, either in terms of the average velocity, V, between the fins or a volumetric flow rate, G. Although this methodology was shown to be useful in examining the effects of heat sink … [Read more...]
Estimating Parallel Plate-Fin Heat Sink Thermal Resistance
As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of applications that require the use of forced convection air-cooled heat sinks to control module temperature. An example of a widely used type of heat sink is the parallel plate … [Read more...]
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