Cree Huizhou Solid State Lighting Co., Ltd. marked the opening on Dec. 8 of its LED chip manufacturing facility at the Huizhou Zhongkai High-tech Industrial Development Zone in Huizhou City, Guangdong Province, China. Cree signed an agreement with Huizhou in November 2009, which involved the establishment of Huizhou Solid State Lighting Co., Ltd. With support from the … [Read more...]
Carbon Nanotubes Enable Pumpless Liquid Cooling System for Computers
Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by increasing frequency speeds in chips. The researchers came up with a design that uses water as the coolant liquid and transfers the water to an … [Read more...]
Compact Water-Circulation System Prevents Stacks of Electronic Chips
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from microchips to maintain a temperature within acceptable limits: less than 100 °C,” explains team-member Navas Khan from the Institute of … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
