Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive to insure superior bond permanence. This label material is designed to provide a 20% lower profile and survive the harsh environments of … [Read more...]
New Flat Wire Inductors Excel At High Temperatures
Datatronics’ new DR79892 and DR 79893 Flat Wire Inductors feature a flat wire design that is coiled and mounted directly to the circuit board to allow efficient heat dissipation. These inductors are designed for performance in power supplies, industrial controls and instrumentation applications. Learn more from Datatronics. … [Read more...]
Thermal Facts and Fairy Tales: Uncertainty is Assured
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of a printed circuit board had determined that a thermal interface material was needed under some hotter components to provide a better conduction path. The circuit card was edge cooled … [Read more...]
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers of the board; and some is dissipated by convection and radiation from the exposed surfaces. There has long been a focus on characterizing the … [Read more...]
Convection and radiation heat loss from a printed circuit board
In last issue's column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from the surface of a PCB to the ambient air. This situation is more challenging to describe mathematically since it involves the simultaneous processes of heat spreading by … [Read more...]
