Extreme Engineering Solutions (X-ES) in Middleton, Wis., is introducing the 8.8 pound XPand4200, a sub-half-ATR, forced-air-cooled enclosure for conduction-cooled modules for embedded computing in vetronics and avionics applications in unmanned aerial vehicles (UAVs), helicopters, fixed-wing aircraft, armored vehicles, and unmanned ground vehicles (UGVs). Electronics thermal … [Read more...]
Modeling Multiple Heat Source Problems In Electronic Systems
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts (such as, we have already attained a level of power density that is comparable to nuclear power stations) would not … [Read more...]
