Fairchild Controls Corporation, an EADS North America company, has signed a teaming agreement with the U.S. Air Force Research Laboratory (AFRL) to evaluate innovative cooling system technologies for avionics and mission systems aboard military aircraft. The Cooperative Research and Development Agreement (CRADA) will result in the joint development and operation of a … [Read more...]
Department of Energy announces $100 million for innovative research projects
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new jobs. Of the three technology focus areas destined to receive funding, one of interest to ElectronicsCooling readers involves … [Read more...]
Advanced Aerodynamics for Electronics Cooling Fans
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these fans has progressed to a lesser degree, and is far removed from turbomachines used in higher power … [Read more...]
Cooling Issues for Automotive Electronics
Electronic content in cars and trucks has significantly increased in the last 30 years. Much of the functional content of these vehicles is now generated or controlled by electronic systems. This trend will continue in the future, as more mechanical functions are converted to electronic and electrical functions. A list of many current automotive electronic functions can be … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
