Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. … [Read more...]
Insulated Metal Printed Circuits – A User-Friendly Revolution In Power Design
Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means higher watt densities, which lead to increased heat. As the operating temperatures of components within a design increase, their performance, stability, and life … [Read more...]
