Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
Packaging: designing for thermal performance
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been able to suspend the laws of physics. Eachcalculation by each of the millions of transistors in the modern personalcomputer is … [Read more...]
