Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Cooling Electronics at High Altitudes Made Easy
Introduction High altitude air cooling has always been somewhat of a mystery to the uninformed. The first reaction to the situation is that there is just not enough air at altitudes greater than six kilometers (20,000 ft). At times this may be true, but many things can be done to improve the cooling and obtain an acceptable design. The most important thing to remember when … [Read more...]
Forced convection cooling inside an electronics enclosure
Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and a cooling fan. This problem becomes more difficult when there are multiple heat sinks and other large components arranged in an arbitrary manner inside … [Read more...]
Standardizing heat sink characterization for forced convection
Figure 1. Wind tunnel configuration Introduction While there has been a flurry of activity inliterature addressing the behavior of heat sinks in computer electronics,the reusability of the data presented in these papers has been somewhatlimited for two reasons: 1) The data presented is application specific. 2) There has never been a standard method for characterizing … [Read more...]
