Novel Concepts, Inc. has developed and has patents pending for the world's thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs and other microelectronic heat generating devices. ThinSink has an amazing thermal performance of 2.73°C/W (degrees Centigrade per … [Read more...]
Forced convection cooling of airborne electronics
Figure 1. AFT description Fin pitch = 25.01 per in = 985 per mPlate spacing, b = 0.200 in = 5.08 x 10-3 m Fin Length = 0.111 in = 2.8 x 10-3 m Flow passage hydraulic diameter 4rh = 0.004905 ft = 1.50 x 10-3 m Fin metal thickness = 0.004 in = 0.102 x 10-3 m Total heat transfer area/volume between plates, ß = 719.4 ft2 / ft3 = 2,360 m2 / m3 Fin area / total area = … [Read more...]
