Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat. As Fujipoly’s softest … [Read more...]
Busbars For Emerging Power Electronics Applications
Rogers Corporation’s Power Distribution Systems Division’s new RO-LINX® PowerCircuit™ busbars was developed to meet the growing power distribution demands in electric vehicle drives, hybrid electric vehicle drives and related charging systems. RO-LINX PowerCircuit busbars are highly engineered solutions for multilayer power distribution delivering optimal thermal management. … [Read more...]
Gap Filler Has Thermal Conductivity of 1.6 W/m-k
T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is critical for design success. As with other family members in the L37 series the product is available in a range of thicknesses, with or without an adhesive … [Read more...]
