Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on the order of a fraction of a millimeter (a few hundred micrometers), have been shown to behave similarly to conventional-sized … [Read more...]
Back to the Future with a Liquid Cooled Supercomputer
Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable operation of successive generations of computers. In many instances the trend toward higher circuit packaging density to provide reductions in circuit delay … [Read more...]
Packaging Challenges For High Heat Flux Devices
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]
Heat transfer measurements in electronics cooling applications
Introduction Increased performance in electronic systems along with higher packaging densities have made temperature a critical parameter. Measurements of temperature, velocity and heat transfer in electronic systems are challenging due to complex materials, configurations, and non-isothermal flows. Earlier articles have considered different aspects of thermal measurements. … [Read more...]
