Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29, covers the use of a variety of cooling components within a hinge assembly. According to the patent, these could include fans, heat sinks, heat spreaders, heat pipes, vents or … [Read more...]
Heat Sink Reliability Risks from Thermal Greases
ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the use of thermal greases as thermal interface materials. The implications are very important as they will affect the MTBF of electronic equipment. Read the paper from ATS Thermal Labs. … [Read more...]
Multiple Platforms CPU Cooler
GlacialTech has introduced the IGLOO 5760 Multiple Platforms CPU cooler. This design incorporates a specially aligned copper heat pipe combination of three pipes that disperse the heat from the CPU directly into the heat sink fins. From there, the silent bullet axial fan quietly and efficiently brings the temperature down. The fan not only cools the radiator, but the added blow … [Read more...]
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on the order of a fraction of a millimeter (a few hundred micrometers), have been shown to behave similarly to conventional-sized … [Read more...]
New heat sink series provide secure attachment with minimum of board real estate
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of increased size and mass. One of the biggest challenges for thermal/mechanical engineers is mechanically mounting larger heat sinks while minimizing the … [Read more...]
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