The new R2 Series of heat sinks from Ohmite combines thermal performance with the attachment mechanism of the popular C Series. This heat sink is capable of attaching either a TO-220 or a TO-247 component and is offered in both degreased and black anodized finishes. The convenient camming clip eliminates the need for mounting holes and screws. By eliminating the need for a … [Read more...]
Bristly Particles Could Manage Heat Flow in Electronics
A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles together. In a recent experiment, students at MIT led by Kripa Varanasi, d’Arbeloff Assistant Professor of Mechanical Engineering, tried sintering copper particles in air and … [Read more...]
New Heat Sink Series with Push Pin Mounting System
Advanced Thermal Solutions, Inc.’s new series of its maxiFLOW™ heat sinks now include an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components Each heat sink comes with a pair of durable push pins in a choice of plastic or brass. The pins push mount easily and securely into 3.00 mm holes in the PCB. The holes are … [Read more...]
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic … [Read more...]
Thermal Grease Provides Thermal Conductivity, Electronic Insulation
Shenzhen Halnziye Electronics Co., Ltd., offers heat sink compounds Thermal Grease Provides Thermal Conductivity, Electronic Insulation, heat sink plaster, heat sink flow and thermal pads. Shenzhen Halnziye’s thermal grease provides high quality thermal conductivity, electronic insulation, weather resistance and smaller surface tension. It is non-corrosive and an ideal thermal … [Read more...]
