Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen across many industries: power electronics, electric vehicles (EV), ever shrinking handheld devices and … [Read more...]
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap … [Read more...]
integrating vapor chambers into thermal solutions
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or wall-mount base stations and radio units, include external fins to improve natural convection and radiation heat transfer rates. Early … [Read more...]
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner article will address the use of interdigitated fins to provide a mechanically tolerant thermal path between two opposing surfaces (e.g., the back … [Read more...]
