As complexity increases and dies and packages become even larger, temperature gradients also increase, leading to problems with thermal mismatch. Hence, thermomechanical analysis grows in importance. Apart from the temperature differences, the most important parameter describing thermally induced stress is the coefficient of thermal expansion (CTE, or °), expressed in units of … [Read more...]
Thermal Conductivity
For most calculations regarding the thermal analysis of electronic systems, thermal conductivities of solid materials are required. It is felt that many designers would welcome a comprehensive list showing these values for certain classes of objects, such as PCB materials, leadframes, molding compounds, alloys etc.. This issue starts with 45 leadframe materials, the data for … [Read more...]
Technical Data
In many cases, especially in the earliest phases of the product creation process, it may be necessary for the Designer to make rough calculations as to the thermal behavior of the proposed product. If a problem is identified, alternative cooling technologies should be considered in the next design phase. In such cases, it is useful to have some idea of the limits of the … [Read more...]
